Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-08-01
2006-08-01
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S703000, C361S709000, C361S710000, C257S706000, C165S080300, C165S185000
Reexamination Certificate
active
07085135
ABSTRACT:
A thermal dissipation structure and method are provided which include a heat sink having a surface configured to couple to a surface of an electronic component for facilitating removal of heat from the component. The heat sink surface and the electronic component surface comprise dissimilar materials with different coefficients of thermal expansion. The heat sink surface has a pattern of channels therein which define multiple heat sink substructures. Each heat sink substructure includes a portion of the heat sink surface. The portions of the heat sink surface are coplanar and provide a reduced distance to neutral point across the heat sink surface. When the portions of the heat sink surface are bonded to the electronic component surface, shear stress within the bond is reduced.
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Chu Richard C.
Ellsworth, Jr. Michael J.
Marotta Egidio E.
Singh Prabjit
Chervinsky Boris
Esq. Lily Neff
Heslin Rothenberg Farley & & Mesiti P.C.
Radigan, Esq. Kevin P.
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