Thermal dissipation of integrated circuits using diamond paths

Details Thermal dissipation of integrated circuits using diamond paths Thermal dissipation of integrated circuits using diamond paths

1992-01-28

1994-05-17

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

Groove

257625, 257 77, H01L 2906

Patent

active

053130944

ABSTRACT:
A heat dissipation apparatus for dissipation of thermal energy from an isolated active silicon region to an underlying supportive substrate is disclosed. Such an apparatus comprises a diamond filled trench having walls extending through the isolated active silicon region, an underlying insulative layer, and into the supportive substrate, whereby said diamond filled trench provides a high thermal conductive path from said active silicon region to said substrate.

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"Fabrication of Microchannels in Synthetic Polycrystalline Diamond Thin Films for Heat Sinking Applications", by R. Ramesham, T. Roppel, and C. Ellis, J. Electrochem. Soc. vol. 138, No. 6, Jun. 1991.

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