Thermal dissipation in integrated circuit systems

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Reexamination Certificate

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C257S690000, C257S707000

Reexamination Certificate

active

07868472

ABSTRACT:
Integrated circuit systems with thermal dissipation enhancement features are described. In one aspect, an integrated circuit system includes a die incorporating an integrated circuit. The die has a top side and a bottom side. The top side supports an electrical signal communication metallization and a top side thermal dissipation metallization. The bottom side supports a bottom side thermal dissipation metallization.

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