Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate
2011-01-11
2011-01-11
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
C257S690000, C257S707000
Reexamination Certificate
active
07868472
ABSTRACT:
Integrated circuit systems with thermal dissipation enhancement features are described. In one aspect, an integrated circuit system includes a die incorporating an integrated circuit. The die has a top side and a bottom side. The top side supports an electrical signal communication metallization and a top side thermal dissipation metallization. The bottom side supports a bottom side thermal dissipation metallization.
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Andújar Leonardo
Avago Technologies General IP ( Singapore) Pte. Ltd.
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