Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-08-08
2008-03-04
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S737000
Reexamination Certificate
active
07339268
ABSTRACT:
A semiconductor die mounted to a flex cable is provided. The flex cable comprises a heat sink layer and a flex cable substrate having conductive traces disposed thereon. The flex cable substrate includes an aperture aligned with the semiconductor die. A thermal conductor disposed within the aperture contacts both the semiconductor die and the heat sink layer. The thermal conductor can comprise, for example, a set of solder balls.
REFERENCES:
patent: 5397921 (1995-03-01), Karnezos
patent: 5420460 (1995-05-01), Massingill
patent: 6156980 (2000-12-01), Peugh et al.
patent: 6255143 (2001-07-01), Briar
patent: 6756684 (2004-06-01), Huang
patent: 2001/0026955 (2001-10-01), Briar
patent: 2005/0093181 (2005-05-01), Brandenberg et al.
Ho Shufun
Hogg Dennis W.
Hosseinzadeh Ali
Tay Chee Shu
Tsay Alex Y.
Carr & Ferrell LLP
Potter Roy
Western Digital Technologies Inc.
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