Thermal dissipating metal core printed circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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H05K 100

Patent

active

RE0297844

ABSTRACT:
A metal core printed circuit board which includes multiple layers of synthetic plastic resin material on a sheet of metal, and wherein the surface of the plastic material is of such character that it provides an acceptable bond on which are built up sundry layers of different metals, the innermost layer on the plastic surface and the other layers positioned one upon another, ultimately comprising a built up circuit pattern, and wherein areas intermediate the circuit pattern comprise an exposed surface of the resin material.

REFERENCES:
patent: 2768293 (1956-10-01), Kepple et al.
patent: 2848359 (1958-08-01), Talmey
patent: 2940018 (1960-07-01), Lee
patent: 3155770 (1964-03-01), Hollenden et al.
patent: 3206342 (1963-09-01), Briggs
patent: 3264524 (1966-08-01), Dahlgren et al.
patent: 3296099 (1967-01-01), Dinella
patent: 3652333 (1972-03-01), Warren

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