Thermal dissipating device

Details Thermal dissipating device Thermal dissipating device

2007-12-20

2009-08-18

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C174S015200, C257S715000, C165S080400, C165S104260

Reexamination Certificate

active

07576986

ABSTRACT:
An exemplary thermal dissipating device is for cooling an electronic component of a circuit board. The thermal dissipating device includes a heat conductive plate with a first side and a second side opposite to the first side, a plurality of heat pipes, and a plurality of fin arrays. The heat conductive plate includes a first part with the first side in closely contact with the electronic component, and a second part perpendicularly disposed beside the first part. The heat pipes are embedded in the second side of the conductive plate, extending from the first part to the second part. One of the fin arrays is attached to the second side of the first part of the conductive plate. The others of the fin arrays are attached to the second part of the conductive plate the first and second sides respectively.

REFERENCES:
patent: 6058012 (2000-05-01), Cooper et al.
patent: 6397941 (2002-06-01), McCullough
patent: 6871702 (2005-03-01), Horng et al.
patent: 7343962 (2008-03-01), Xia et al.
patent: 7405937 (2008-07-01), Wang et al.
patent: 7440279 (2008-10-01), Lai et al.
patent: 2007/0074857 (2007-04-01), Xia et al.

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