Thermal detector apparatus and method using reduced thermal capa

Details Thermal detector apparatus and method using reduced thermal capa Thermal detector apparatus and method using reduced thermal capa

1994-04-29

1995-10-10

Hannaher, Constantine

Radiant energy

Infrared-to-visible imaging

Including detector array

2503383, G01J 506

Patent

active

054573181

ABSTRACT:
A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).

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