Thermal design for minimizing interface in a multi-site...

Details Thermal design for minimizing interface in a multi-site... Thermal design for minimizing interface in a multi-site...

2005-05-03

2005-05-03

Thompson, Gregory D. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S185000, C174S016300, C257S707000, C257S713000, C361S708000, C361S700000

Reexamination Certificate

active

06888722

ABSTRACT:
An electronic assembly that may include an integrated circuit package that is mounted to a substrate. The assembly may have a thermally conductive phase change material that couples the integrated circuit package to a thermal element. The phase change material may be assembled in a liquid phase to fill any gap between the package and the thermal element. The phase change material may exist in a solid phase during normal operation of the assembly so that the material does not bleed from the package/thermal element interface.

REFERENCES:
patent: 4602314 (1986-07-01), Broadbent
patent: 4915167 (1990-04-01), Altoz
patent: 5097387 (1992-03-01), Griffith
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5323294 (1994-06-01), Layton et al.
patent: 5548482 (1996-08-01), Hatauchi et al.
patent: 5617294 (1997-04-01), Watson et al.
patent: 5699227 (1997-12-01), Kolman et al.
patent: 5748446 (1998-05-01), Feightner et al.
patent: 5831831 (1998-11-01), Freeland
patent: 5880524 (1999-03-01), Xie
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5894408 (1999-04-01), Stark et al.
patent: 5895972 (1999-04-01), Paniccia
patent: 5898219 (1999-04-01), Barrow
patent: 5903436 (1999-05-01), Brownell et al.
patent: 5917702 (1999-06-01), Barrow
patent: 5920120 (1999-07-01), Webb et al.
patent: 5923086 (1999-07-01), Winer et al.
patent: 5933323 (1999-08-01), Bhatia et al.
patent: 5936838 (1999-08-01), Lii et al.
patent: 5949647 (1999-09-01), Kolman et al.
patent: 5965937 (1999-10-01), Chiu et al.
patent: 5969944 (1999-10-01), Borkar et al.
patent: 5978228 (1999-11-01), Borkar et al.
patent: 5990549 (1999-11-01), Chiu et al.
patent: 6008988 (1999-12-01), Palmer
patent: 6011696 (2000-01-01), Mahajan et al.
patent: 6016006 (2000-01-01), Kolman et al.
patent: 6028771 (2000-02-01), Wong et al.
patent: 6030251 (2000-02-01), Stark et al.
patent: 6043560 (2000-03-01), Haley et al.
patent: 6043984 (2000-03-01), Tseng
patent: 6046905 (2000-04-01), Nelson et al.
patent: 6046906 (2000-04-01), Tseng
patent: 6054198 (2000-04-01), Bunyan et al.
patent: 6084775 (2000-07-01), Bartley et al.

Affiliated with

Also associated with

Rating

Thermal design for minimizing interface in a multi-site... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal design for minimizing interface in a multi-site..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal design for minimizing interface in a multi-site... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3459596