Compositions – Heat-exchange – low-freezing or pour point – or high boiling... – Organic components
Patent
1992-04-15
1993-10-05
Willis, Jr., Prince
Compositions
Heat-exchange, low-freezing or pour point, or high boiling...
Organic components
252573, 252572, 165185, C09K 500, H02B 100
Patent
active
052502090
ABSTRACT:
A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic alkylene oxide modified silicone carrier, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an antioxidant and an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.
REFERENCES:
patent: 3405066 (1968-10-01), McGhee et al.
patent: 3885984 (1975-05-01), Wright
patent: 4029628 (1977-06-01), Fredberg
patent: 4076684 (1978-02-01), Wohlfarth et al.
patent: 4265775 (1981-05-01), Aakalu et al.
patent: 4299715 (1981-11-01), Whitfield et al.
patent: 4416790 (1983-11-01), Schurmann et al.
patent: 4422962 (1983-12-01), Chichanowski
patent: 4466483 (1984-08-01), Whitfield et al.
patent: 4473113 (1984-09-01), Whitfield et al.
patent: 4518513 (1985-05-01), Lochner et al.
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4686057 (1987-08-01), Lochner et al.
patent: 4744914 (1988-05-01), Filisko et al.
patent: 4756851 (1988-07-01), Billigmeier et al.
patent: 4869954 (1989-09-01), Squitieri
patent: 5075023 (1991-12-01), Fukuyama et al.
patent: 5094769 (1992-03-01), Anderson, Jr. et al.
patent: 5167851 (1992-12-01), Jamison et al.
"Materials/Processing Approaches to Phase Stabilization of Thermally Conductive Pastes", Anderson, Jr. and Booth, IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 13, No. 4, Dec. 1990.
Product advertisement/information sheet from Thermalloy, Inc., for Thermalcote II. (date unknown).
Jamison William L.
Larsen Gary J.
Sears, Jr. George E.
Silbermann J.
Thermoset Plastics, Inc.
Willis Jr. Prince
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