Thermal coupling with water-washable thermally conductive grease

Details Thermal coupling with water-washable thermally conductive grease Thermal coupling with water-washable thermally conductive grease

1992-04-15

1993-10-05

Willis, Jr., Prince

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

252573, 252572, 165185, C09K 500, H02B 100

Patent

active

052502090

ABSTRACT:
A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic alkylene oxide modified silicone carrier, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an antioxidant and an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.

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Product advertisement/information sheet from Thermalloy, Inc., for Thermalcote II. (date unknown).

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