Thermal coupling to enhance heat transfer

Details Thermal coupling to enhance heat transfer Thermal coupling to enhance heat transfer

1988-08-05

1990-04-10

Schwadron, Martin P.

Heat exchange

Heat transmitter

165 804, 361386, 361387, F28F 700

Patent

active

049151673

ABSTRACT:
The invention is a thermal coupling to promote heat transfer between a heat source and a heat sink with abutting surfaces using a deposition of a thermally conductive substance having a melting point temperature less than the temperature of the heat source such that the substance when heated will be in a liquid state capable of effectively transferring heat between the heat source and the heat sink. The deposition is situated between and contacts the abutting surfaces of the heat source and the heat sink. The substance is contained using a sealant to completely enclose the substance between the heat source and heat sink surface while an adhesive is used to secure the heat source to the heat sink.

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patent: 3626252 (1971-12-01), Cath
patent: 3965973 (1976-06-01), Thettu et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4151547 (1979-04-01), Rhoades et al.
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4384610 (1983-05-01), Cook et al.
Nuthes, R. W., "Semiconductor Chip With Liquid Metal Heat Transfer", IBM Tech. Discl. Bulletin, vol. 22, #4, Sep. 1979, p. 1553.
"A Novel Concept for Reducing Thermal Contact Resistance", AIAA-82-0866, Cook, Token & Calkins, Jun. 1982.
"Construction of a liquid Metal Filled Module", Arnold et al., IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979, pp. 602-605.
"An Experimental Investigation of Free-Convection Heat Transfer from Rectangular-Fin Arrays", Starner & McManus, Jr., Journal of Heat Transfer, Aug. 1963, Transactions of the ASME, pp. 273-278.

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