Thermal coupling device

Details Thermal coupling device Thermal coupling device

2007-10-16

2007-10-16

Choe, Henry (Department: 2817)

Amplifiers

With semiconductor amplifying device

Including temperature compensation means

C330S20700P

Reexamination Certificate

active

11117832

ABSTRACT:
A micro-electronic power amplifier that defines a uniform thermal impedance includes an output stage including a single transistor array including a plurality of emitter leads and a single thermal coupling device that thermally couples together each of the emitter leads.

REFERENCES:
patent: 4389557 (1983-06-01), Devenyi et al.
patent: 4939562 (1990-07-01), Adlerstein
patent: 5734193 (1998-03-01), Bayraktaroglu et al.
patent: 6884661 (2005-04-01), Morris et al.
patent: 2006/0072296 (2006-04-01), Mays

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