Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
1999-05-10
2001-05-15
Lazarus, Ira S. (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S104330, C165S274000
Reexamination Certificate
active
06230790
ABSTRACT:
FIELD OF THE INVENTION
The present invention generally relates to thermal control systems and, in particular, relates to a thermal control system for use in controlling the temperature of heat sources on spacecraft.
BACKGROUND OF THE INVENTION
Generally, conventional thermal control systems are designed primarily to remove or dissipate heat energy generated by electronic equipment mounted on structural panels. In some cases, such systems utilize structural panels on the exterior walls of a spacecraft or aircraft, such that heat energy is transferred through the thickness of the structural panel and then radiated into the surrounding environment. In order to cool electronic equipment, large, efficient radiative surfaces of structural panels are typically utilized. Another conventional way to cool electronic equipment includes providing constant conductance heat pipes which function as liquid coolant flow passages to increase the structural panel's heat transport capability. However, and as noted in U.S. Pat. No. 5,506,032, the additional weight of a more massive structural panel or of liquid cooling systems are not tolerable or desirable in some applications.
In addition, and in spite of the primary focus of such conventional thermal control systems to dissipate heat energy, electronic equipment performance can be degraded during high duty-cycle periods if sufficient amounts of heat energy cannot be dissipated. In other instances, where electronic equipment is operating at low duty-cycles, conventional thermal control systems for dissipating heat energy from electronic equipment are not desirable since the performance of such electronic equipment can degrade when operating at cooler temperatures (e.g., less than 10 degrees Celsius). Finally, without larger heater power, conventional thermal control systems are not typically capable of preserving the functionality of electronic equipment (e.g, at less than −20degrees Celsius and when the electronic equipment is powered off).
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a system and method for controlling the temperature of heat sources (e.g. electronic equipment) on mobile craft, such as spacecraft or in ground-based stationary structures.
It is another object of the present invention to provide a system and method for maintaining the temperature of heat sources aboard a spacecraft within a desirable range of operating temperatures to enhance performance of such heat sources.
It is still another object of the present invention to provide a system and method for regulating the temperature of heat sources to preserve the functionality of such heat sources in extreme environments.
In one aspect, the present invention is embodied in a thermal control system for use in regulating the temperature of at least a first heat source (e.g. an electronic equipment) of a spacecraft. Generally, the thermal control system may include a structure for supporting at least the first heat source, the first heat source being interconnectable to the structure, and at least a first heat pipe associated with the structure, the first heat pipe being capable of transferring heat energy of at least the first heat source from the first heat source, proximate a first surface (e.g., inboard surface) of the structure, toward a second surface (e.g., outboard surface) of the structure and/or inhibiting or limiting such transfer of heat energy of at least the first heat source toward the second surface of the structure. The first heat pipe may include first and second end portions (e.g., inboard and outboard end portions), the first end portion being positionable and/or thermally couplable to the first surface of the structure and/or to at least the first heat source, and the second end portion of the first heat pipe being positionable and/or thermally couplable to the second surface of the structure and/or a second heat pipe which is thermally couplable to the second end portion of the first heat pipe. Of importance, at least the first heat pipe of the system of the present invention is embeddable within the structure of the present invention, and includes an intermediate portion extending between the first and second end portions. Such intermediate portion of the first heat pipe may be angled relative to the first and second surfaces of the structure to provide the capability to transfer heat energy directly from the first surface of the structure and/or the first heat source to the second surface of the structure and/or to the second heat pipe, through the interior of the structure, and to inhibit such transfer of heat energy, depending upon the environment and duty-cycle of the first heat source. By virtue of this compact packaging arrangement, the thermal control system of the present invention may function to regulate the temperature of at least the first heat source by at least dissipating heat energy from at least the first heat source and/or minimizing the transfer of heat energy from the first heat source to the second surface of the structure and/or to the second heat pipe.
Specifically, in one embodiment, the first heat pipe comprises a first variable conductance heat pipe having a first reservoir and a first reservoir heater which is thermally couplable to the first reservoir to heat a non-condensible gas contained within the first reservoir. In a first mode of operation of the thermal control system of the present invention, in instances where at least the first heat source is operating, it may be desirable to dissipate heat energy from at least the first heat source via the first variable conductance heat pipe to keep at least the first heat source within a desirable range of operating temperatures to thereby optimize performance of at least the first heat source. In this first mode of operation, the first reservoir heater may be deactivated or turned “off”, which allows heat energy to be transferred from the first end portion to the second end portion of the first variable conductance heat pipe and thus to the second heat pipe thermally couplable thereto and/or the second surface of the structure to dissipate heat energy from at least the first heat source. In this first mode of operation, the first variable conductance heat pipe functions as a constant conductance heat pipe to transfer heat energy through the interior of the structure. In a second mode of operation of the thermal control system of the present invention, it may be desirable to inhibit the transfer of heat energy from the first heat source in order to maintain at least the first heat source within a desirable range of temperatures to thereby optimize performance of at least the first heat source and/or to preserve the functionality of at least the first heat source. In this second mode of operation, dissipation of heat energy from the first heat source to the environment via first variable conductance heat pipe may be minimized by activating or turning “on” at least the first reservoir heater to heat the non-condensible gas contained within the first reservoir, which functions to inhibit the transfer of heat energy from the first heat source to the second surface of the structure.
In another aspect, the system of the present invention is directed to controlling or regulating the temperature of at least a first heat source (e.g., an electronic equipment) in at least one of three modes of operation or states of operation. Generally, the three operational states function to substantially maintain the electronic equipment temperature within a desirable range(s). In particular, the system may be designed to maintain the temperature of at least the first heat source at or near room temperatures (e.g., within 10° Celsius to 40° Celsius). In other instances, the system may function to keep the temperature of electronic equipment within certain limits (e.g., within −24° C. to 61° C.) to preserve the functionality of the electronic equipment in extreme environments. Of course, the system may function to maintain and/or preserve t
Hemingway Michael D.
Hicks Glen W.
Hull, III Dwight E.
Ritchie Michael D.
Duong Tho
Lazarus Ira S.
Lockheed Martin Corporation
Marsh & Fischmann & Breyfogle LLP
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