Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-01-10
2006-01-10
Patel, Paresh (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C062S003100, C062S003200
Reexamination Certificate
active
06985000
ABSTRACT:
A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.
REFERENCES:
patent: 3700857 (1972-10-01), Brandes et al.
patent: 3836751 (1974-09-01), Anderson
patent: 4126824 (1978-11-01), Thornburg et al.
patent: 4357526 (1982-11-01), Yamamoto et al.
patent: 4374316 (1983-02-01), Inamori et al.
patent: 4624137 (1986-11-01), Johnson et al.
patent: 4684783 (1987-08-01), Gore
patent: 4744246 (1988-05-01), Busta
patent: 4777434 (1988-10-01), Miller et al.
patent: 4808009 (1989-02-01), Sittler et al.
patent: 4909078 (1990-03-01), Sittler et al.
patent: 4956793 (1990-09-01), Bonne et al.
patent: 5059770 (1991-10-01), Mahawii
patent: 5126656 (1992-06-01), Jones
patent: 5164661 (1992-11-01), Jones
patent: 5315240 (1994-05-01), Jones
patent: 5352870 (1994-10-01), Daugherty et al.
patent: 5420520 (1995-05-01), Anschel et al.
patent: 5420521 (1995-05-01), Jones
patent: 5539186 (1996-07-01), Abrami et al.
patent: 5550482 (1996-08-01), Sano
patent: 5605612 (1997-02-01), Park et al.
patent: 5643483 (1997-07-01), Kubota et al.
patent: 5669419 (1997-09-01), Haas
patent: 5672980 (1997-09-01), Charlton et al.
patent: 5740016 (1998-04-01), Dhindsa
patent: 5751015 (1998-05-01), Corbett et al.
patent: 5821505 (1998-10-01), Tustaniwskyj et al.
patent: 5911897 (1999-06-01), Hamilton
patent: 5940110 (1999-08-01), Nakamura et al.
patent: 5977785 (1999-11-01), Burward-Hoy
patent: 5982013 (1999-11-01), Kishi et al.
patent: 6389225 (2002-05-01), Malinoski et al.
patent: 2002/0033391 (2002-03-01), Malinoski et al.
patent: WO 98/05060 (1998-02-01), None
patent: WO 00/04582 (2000-01-01), None
Thermal Measurement Chips (TMC-s), http://www.micred.com/prodserv/products/measdev/test—dies/ttmc.html, MicReD Ltd. Last Modified: Nov. 26, 2001.
The Science Behind Cool Chips™ and Power Chips™ A Basic Introduction, http://www.coolchips.gi/LowWorkFunctionExplanation.shtml, Cool Chips pic Last Updated: Feb. 8, 2002.
Thermo Material May Replace Heat Sinks, Fans in Electronic Gear, By R. Colin Johnson, EE Times, Feb. 24, 2002, http://www.eetimes.com/printableArticle?doc—id×OEG20000224S0014.
A Solid-State Microelectronic Cooler Operating From above Amblent to Cryogenic Temperatures, Paul Cutler, Nicholas Miskovsky (Penn State University, University Park, PA 16802), Moon S. Chung (University of Ulsan, Ulsan, Korea), Nalin Kumar (UHV Technologies, Inc., Mt. Laurel, NJ), http://www.aps.org/meet/MAR01/baps/abs/S7990013.html, Mar. 2001, APS Meeting.
Beyerle Rick
Byers Stephen
Feder Jan
Jones Thomas
Delta Design, Inc.
Foley & Lardner LLP
Patel Paresh
LandOfFree
Thermal control of a DUT using a thermal control substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal control of a DUT using a thermal control substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal control of a DUT using a thermal control substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3592151