Thermal control members, bubble memory

Static information storage and retrieval – Magnetic bubbles – Disposition of elements

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G11C 504

Patent

active

041986881

ABSTRACT:
A package having bubble memory components including bubble memory chips or modules disposed between bias magnets for maintaining and establishing bubbles in said chips, field drive coils for propagating the bubbles therein and further including thermal control means for stabilizing and dissipating the heat generated in the package and which also aid in the packaging of the components. The thermal control means include discrete compliant members of thermally conductive material which also aid in the assembly of the package, additional thermal members and spacing means both also of thermally conductive material which locate the chips relative to the bias magnets.

REFERENCES:
patent: 4096581 (1978-06-01), Carlo et al.
patent: 4101970 (1978-07-01), Saito et al.

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