Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-04-19
2005-04-19
Thompson, Gregory D. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080400, C165S185000, C257S714000, C257S719000, C361S702000, C361S715000, C361S719000
Reexamination Certificate
active
06882533
ABSTRACT:
A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
REFERENCES:
patent: 4825337 (1989-04-01), Karpman
patent: 5153815 (1992-10-01), Suzuki et al.
patent: 5473506 (1995-12-01), Kikinis
patent: 5640302 (1997-06-01), Kikinis
patent: 6205023 (2001-03-01), Moribe et al.
patent: 6349035 (2002-02-01), Koenen
patent: 6393853 (2002-05-01), Vukovic et al.
R. Hannemann, L. R. Fox and M. Mahalingham, “Thermal Design for Microelectronic Components,” in “Advances in Cooling Techniques for Computers” 245-276 (Win Aung ed., Hemisphere Publishing Corporation, 1991).
“Advances in Cooling Techniques for Computers” 150-153 (Win Aung ed., Hemisphere Publishing Corporation, 1991).
Robert Darveaux and Iwona Turlik, “Backside Cooling of Flip Chip Devices in Multichip Modules,” ICMCM Proc. 230-241 (1992).
Herman W. Chu, Christian L. Belady and Chandrakant D. Patel, “A Survey of High-performance, High Aspect Ratio, Air Cooled Heat Sinks,” International Systems and Packaging Symposium (1999).
Chandrakant D. Patel, “Backside Cooling Solution for High Power Flip Chip Multi-Chip Modules,” IEEE ECTC Proceedings 442-449 (May, 1994).
Bash Cullen E.
Patel Chandrakant D.
Simon Glenn C.
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