Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-10-19
2001-05-08
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S688000, C361S689000, C361S699000, C361S700000, C361S702000, C361S715000, C361S716000, C174S015100, C174S015200, C165S080400, C165S185000
Reexamination Certificate
active
06229704
ABSTRACT:
TECHNICAL FIELD
This invention relates to computer systems, and more particularly to devices for transferring heat away from internal computer system components.
BACKGROUND
Heat dissipation is a major issue in the design and operation of semiconductor devices (“chips”). Too much heat can destroy the structure of a chip and affect its operation. The tight packing of chips in today's computer systems makes them even more vulnerable to damage from heat.
One approach to avoiding overheating is with the use of an active cooling device, such as a fan. Conventionally, a fan is a component of the computer system, contained in the computer chassis.
Another approach to avoiding overheating is the use of a passive cooling device, such as a heatsink. A heatsink provides a surface area from which heat can radiate. Many heatsinks have fins or some other geometry that increases their surface area. They are made from a material having good thermal conduction, such as aluminum. Some computers are designed so that the computer chassis provides a heatsink. An advantage of passive cooling devices is that no power-consuming mechanism is required; the heatsink operates by natural convection whereby warm air rises away from the heatsink and cool air flows toward the heatsink to replace the warm air.
Both fans and heat sinks present design challenges because they must be placed where they will be effective, yet not add bulk to the computer system. Also, electrical design considerations result in competition between electrical components and thermal components for the same “real estate”.
Heat pipes have been used to alleviate design problems to some extent. Heat pipes are used in conjunction with heatsinks, and conduct heat away from a heat-generating component to the heat sink. A popular design of today's computers is the use of the computer chassis as a heatsink with heat pipes conducting heat from the internal components to the chassis. However, the addition of heat pipes has often resulted in increased manufacturing complexity and reduced serviceability after manufacture, because of the connections required for the heat pipes.
SUMMARY
One aspect of the invention is a thermal connection system for cooling integrated circuit components. The thermal connection system has a number of component heat conductors. One end of the component heat conductor is connectable to an integrated circuit component, such that the heat conductor extends from the integrated circuit component generally parallel to other component heat conductors. Each component heat conductor has an associated arterial heat conductor, which is connectable to a heat sink at one end such that it extends from the heat sink. A thermal connector orthogonally connects the free end of each component heat conductor to the free end of each arterial heat conductor. The thermal connector is removably attached to the component heat conductor, and it may also be removably attached to the arterial heat conductor. In this manner, each thermal connector provides a complete heat transfer path from a heat-generating component to the heat sink.
As a result of the above-described thermal connection system, components are thermally connected to one or more arterial heat conductors, rather than directly to the heat sink. The thermal connectors permit components to be easily added and removed. The connector provides a self-aligned connection, which reduces manufacturing effort.
The design provides for a central cooling location for all components, and relaxes constraints related to the need for cooling devices immediately proximate to the components to be cooled. This permits even the most critical components, such as processor and memory units, to be reduced in size, more tightly packed, and more easily serviced.
The above-described thermal connection system is consistent with a removable modular design for processing and memory components of a computer system. Each module contains one or more integrated circuit components. The thermal connectors permit the modules to have “plug in” thermal connections.
REFERENCES:
patent: 3035419 (1962-05-01), Wigert
patent: 3620298 (1971-11-01), Somerville et al.
patent: 4120019 (1978-10-01), Arii et al.
patent: 4627487 (1986-12-01), Basiulis
patent: 5343358 (1994-08-01), Hilbrink
patent: 5398748 (1995-03-01), Yamaji et al.
patent: 5557501 (1996-09-01), DiStefano et al.
patent: 5568360 (1996-10-01), Penniman et al.
patent: 5597035 (1997-01-01), Smith et al.
patent: 5718282 (1998-02-01), Bhatia et al.
patent: 5781409 (1998-07-01), Mecredy, III
patent: 5796581 (1998-08-01), Mok
patent: 5822187 (1998-10-01), Garner et al.
patent: 5826645 (1998-10-01), Meyer, IV et al.
patent: 5828549 (1998-10-01), Gandre et al.
patent: 5829515 (1998-11-01), Jeffries et al.
patent: 5832987 (1998-11-01), Lowry et al.
patent: 5898569 (1999-04-01), Bhatia
patent: 5936836 (1999-08-01), Scholder
patent: 5946191 (1999-08-01), Oyamada
patent: 5959836 (1999-09-01), Bhatia
patent: 6052285 (2000-04-01), Hileman
patent: 6125035 (2000-09-01), Hood, III et al.
Hoss Shawn P.
Moss David L.
Baker & Botts L.L.P.
Chervinsky Boris L.
Dell USA L.P.
Picard Leo P.
LandOfFree
Thermal connection system for modular computer system... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal connection system for modular computer system..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal connection system for modular computer system... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2508184