Thermal connection layer

Details Thermal connection layer Thermal connection layer

2005-02-08

2005-02-08

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C165S080200, C165S185000, C257S719000, C361S702000, C361S705000, C361S708000, C361S710000, C361S719000, C361S720000

Reexamination Certificate

active

06853554

ABSTRACT:
A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

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Chandrakant D. Patel, “Backside Cooling Solution for High Power Flip Chip Multi-Chip Modules,” IEEE ECTC Proceedings 442-449 (May, 1994).
R. Hannemann, L. R. Fox and M. Mahalingham, “Thermal Design for Microelectronic Components,” in “Advances in Cooling Techniques for Computers” 245-276 (Win Aung ed., Hemisphere Publishing Corporation, 1991).
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Copending U.S. Appl. No. 10/023,227, filed Dec. 14, 2001, Entitled “Thermal Connector for Cooling Electronics,” Inventors: Cullen Bash, Chandrakant Patel, and Glenn Simon.
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