Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-11-07
2000-03-28
Tolin, Gerald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, 361719, H05K 720
Patent
active
060439858
ABSTRACT:
A connecting structure (23) for establishing a thermal connection between at lest two components (21, 22) composed of materials with different expansion coefficients, wherein at least one component forms an electronic power element (21) and higher-melting-point materials are used for the contacting, which higher-melting-point materials form isolated connecting elements (29) between the contact surfaces (27, 28) of the components (21, 22).
REFERENCES:
patent: 5591941 (1997-01-01), Acocella
patent: 5640051 (1997-06-01), Tomura
patent: 5672542 (1997-09-01), Schwiebert
patent: 5764485 (1998-06-01), Lebaschi
patent: 5773884 (1998-06-01), Andros
patent: 5808874 (1998-09-01), Smith
Gupta, Debabrata A Novel Active Area Bumped Flip Chip Technology for Convent Heat Transfer from Gallium Arsenide Power Devices, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A. vol. 18, No. 1, Mar. 1995 Derwent Abstract corresponding to DE 30 31 912.
Azdasht Ghassem
Badrihafifekr Habib
Kasulke Paul
Weiss Stefan
Zakel Elke
Fraunhofer-Gesellschaft zur Forderung der ange-wandten Forschung
Tolin Gerald
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