Thermal connecting structure for connecting materials with diffe

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174252, 361719, H05K 720

Patent

active

060439858

ABSTRACT:
A connecting structure (23) for establishing a thermal connection between at lest two components (21, 22) composed of materials with different expansion coefficients, wherein at least one component forms an electronic power element (21) and higher-melting-point materials are used for the contacting, which higher-melting-point materials form isolated connecting elements (29) between the contact surfaces (27, 28) of the components (21, 22).

REFERENCES:
patent: 5591941 (1997-01-01), Acocella
patent: 5640051 (1997-06-01), Tomura
patent: 5672542 (1997-09-01), Schwiebert
patent: 5764485 (1998-06-01), Lebaschi
patent: 5773884 (1998-06-01), Andros
patent: 5808874 (1998-09-01), Smith
Gupta, Debabrata A Novel Active Area Bumped Flip Chip Technology for Convent Heat Transfer from Gallium Arsenide Power Devices, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A. vol. 18, No. 1, Mar. 1995 Derwent Abstract corresponding to DE 30 31 912.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal connecting structure for connecting materials with diffe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal connecting structure for connecting materials with diffe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal connecting structure for connecting materials with diffe will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1331542

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.