Thermal conductive material utilizing electrically...

Details Thermal conductive material utilizing electrically... Thermal conductive material utilizing electrically...

2003-09-03

2009-06-23

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C165S185000, C106S001180

Reexamination Certificate

active

07550097

ABSTRACT:
Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.

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U.S. Appl. No. 10/426,485, filed Apr. 29, 2003.
Search Report Dated Feb. 7, 2005 for corresponding PCT application # PCT/US2004/025262.

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