Thermal conductive composition, a heat dissipating putty...

Details Thermal conductive composition, a heat dissipating putty... Thermal conductive composition, a heat dissipating putty...

2006-11-14

2006-11-14

Zimmer, Marc S. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of silicon containing

C428S156000, C524S404000, C524S424000, C524S428000, C524S588000, C528S031000, C528S032000

Reexamination Certificate

active

07135232

ABSTRACT:
The present invention provides a thermal conductive composition formed by blending a thermal conductive filler of not less than 600 mass parts to 100 mass parts of a liquid silicone having a viscosity in a range of 20 to 2000 mPa·s. Since the thermal conductive composition is not crosslinked further or cured at a normal temperature of 25° C., it keeps a putty state, and the thermal conductivity is not less than 3 W/m·K. A heat-dissipating putty sheet according to the present invention is formed by applying the thus obtained thermal conductive composition onto a release sheet. The heat-dissipating putty sheet having a thickness ranging from 0.5 mm to 3 mm can be released manually from a release base, or it can be transferred from a release sheet to a heat-generating part or a dissipator so as to be attached to a desired position easily.

REFERENCES:
patent: 2003/0113556 (2003-06-01), Feng et al.
patent: 2004/0254275 (2004-12-01), Fukui et al.
patent: 114000 (1983-01-01), None
patent: 939115 (1999-09-01), None
patent: 7-183434 (1995-07-01), None
patent: 2004-331835 (2004-11-01), None
patent: WO02/092693 (2002-11-01), None

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