Thermal conduction piston for semiconductor packages

Details Thermal conduction piston for semiconductor packages Thermal conduction piston for semiconductor packages

1981-11-17

1984-07-31

Cline, William R.

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

357 81, 361386, H01L 2342

Patent

active

044624620

ABSTRACT:
An improved conduction cooling system for a semiconductor package that includes a slidable conduction cooling piston in contact with a device and mounted in a cap or cold plate, a means for urging the piston longitudinally and laterally into contact with the device and the cap or cold plate, respectively, and a means to prevent rotation of the piston.

REFERENCES:
patent: 3993123 (1976-11-01), Chu et al.
patent: 4193445 (1980-03-01), Chu et al.
patent: 4235283 (1980-11-01), Gupta
Bhattacharya and Sullivan, IBM Technical Disclosure Bulletin, vol. 21, No. 2, Jul. 1978, "Chip Cooling Package".
Hasson and Tomka, IBM Technical Disclosure Bulletin, vol. 23, No. 1, Jun. 1980, "Pistons for Cooling Circuit Chip".
Meeker, Scanlon and Segal, IBM Technical Disclosure Bulletin, vol. 20, No. 7, Dec. 1977, "Module Thermal Cap for Semiconductor Chip Package".

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