Thermal conduction module with barrel shaped piston for improved

Details Thermal conduction module with barrel shaped piston for improved Thermal conduction module with barrel shaped piston for improved

1988-10-31

1991-04-09

Flanigan, Allen J.

Heat exchange

With retainer for removable article

Electrical component

165185, 357 81, 361386, F28F 700, H05K 720

Patent

active

050056387

ABSTRACT:
An otherwise conventional multi-chip circuit module called a thermal conduction module (TCM) is provided with "barrel shaped" pistons that give improved cooling for chips that may be tilted with respect to their pistons. The piston has a cylindrical mid-section and tapered end sections. The barrel shape permits the piston to tilt with the chip even though the mid-section has the desirable close fit of conventional convex face pistons. The length of the mid-section is selected to permit the piston to tilt to the angle of the taper of the ends. Because the piston can tilt with the chip, the end that contacts the chip is flat for good heat transfer. The result is improved heat transfer by a lower combined thermal resistance of the gap between piston and chip and the gap between piston and hat versus conventional pistons.

REFERENCES:
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Research Disclosure No. 251, Mar. 1985, Kenneth Mason Publications Ltd., England.
IBM Technical Disclosure Bulletin, vol. 21, No. 8, Jan. 79, pp. 3211-3212--"Thermal Conduction Piston for Semiconductor Packages" by L. Landstein.
IBM Technical Dislosure Bulletin, vol. 21, No. 11, Apr. 79, p. 4493--"Liquid Piston Tip" by P. Ginnings and J. Lynch.
IBM Technical Disclosure Bulletin, vol. 23, No. 4, p. 1400, 9/80, "Self-Aligning Heat Transfer Pad for Pad-Mounted Chips" by R. Durand et al.
IBM Technical Disclosure Bulletin, vol. 20, No. 8, pp. 3131/3132, 1/78, "Articulated Thermal Conductor for Semiconductor Chip Packages" by L. V. Gregor et al.
IBM Technical Disclosure Bulletin, vol. 23, No. 12, p. 5489, 5/81, "Gimbal-Suspended Cooling Piston", by W. Otte et al.

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