Thermal conduction element for conducting heat from semiconducto

Details Thermal conduction element for conducting heat from semiconducto Thermal conduction element for conducting heat from semiconducto

1982-06-28

1984-10-23

James, Andrew J.

357 82, 357 79, H01L 2336, H01L 2340

Patent

active

044791402

ABSTRACT:
A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cover positioned in close proximity to the bridge element has an axially compressible spring member with a bulged central portion, a first flat plate member adapted to be placed in contact with the device, a second flat plate member adapted to be disposed in contact with the cold plate or cover, and a means to maintain the spring member, the first plate member and the second plate member in operative engagement.

REFERENCES:
patent: 3315136 (1967-04-01), Lob
patent: 3449642 (1969-06-01), Ortner et al.
patent: 3717797 (1973-02-01), Rydeski
patent: 3896544 (1975-07-01), Fosnough
patent: 3996447 (1976-12-01), Bouffard et al.
patent: 4093971 (1978-06-01), Chu et al.
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4263965 (1981-04-01), Mansuria et al.
"Semiconductor Module with Improved Air Cooling," Zirnis-IBM Tech. Disclosure Bulletin, vol. 20, No. 5, Oct. 1977, p. 1768.
IBM TDB, vol. 20, No. 11A, Apr. 1978, p. 4336.
IBM TDB, vol. 21, No. 3, Aug. 1978, p. 1141.

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