Thermal conduction disc-chip cooling enhancement means

Details Thermal conduction disc-chip cooling enhancement means Thermal conduction disc-chip cooling enhancement means

1986-06-20

1987-01-27

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 165185, 357 79, 357 82, 361385, H05K 720

Patent

active

046398295

ABSTRACT:
A device to thermally couple a heat dissipating integrated circuit chip to the heat sink in a thermal conduction module for effective cooling of the chip by minimizing the thermal resistance path from the chip to the sink. The device is a combination of a heat conducting flat based, truncated solid conical disc which is spring loaded on the back of the chip and a heat conductive hat member having an opening with a continuous tapered wall to conformally fit over the truncated conical disc. The gap between the disc and the hat is packed with a thin layer of a high thermal conductivity grease to provide a low interfacial thermal resistance and mechanical flexibility between the disc and the hat. For additional cooling enhancement of the chip, at the interface between the chip back surface and the base of the disc a self-healing alloy having a high thermal conductivity and low melting point is provided.

REFERENCES:
patent: 3972012 (1976-07-01), Liu
patent: 3993123 (1976-11-01), Chu et al.
patent: 4246597 (1981-01-01), Cole et al.
patent: 4381032 (1983-04-01), Cutchaw
"Thermally Enhanced Semiconductor Chip Packaging Structure" by C. P. Coughlin et al., IBM Technical Disclosure Bulletin, vol. 21, No. 1, Jun. 1978, p. 185.
"Silicon Heat Sink Method to Control Integrated Circuit Chip Operating Temperatures" by W. E. Ahearn et al., IBM Tech. Discl. Bulletin, vol. 21, No. 8, Jan. 1979, pp. 3378-3380.
"Thermal Conduction Module: A High-Performance Multilayer Ceramic Package" by A. J. Blodgett et al., IBM J. Res. Develop. vol. 26, No. 1, Jan. 1982, pp. 30-36.
"Conduction Cooling for an LSI Package: A One-Dimensional Approach" by R. C. Chu et al., IBM J. Res. Develop. vol. 26, No. 1, Jan. 1982, pp. 45-54.
"Chip Cooling" by P. W. Ing, ITM Technical Disclosure Bulletin, vol. 13, No. 5, Oct. 1970, p. 1060.
J. K. Hassan et al., "High Performance Chip-Cooling Technique" IBM Technical Disclosure Bulletin, vol. 26, No. 7A, 12/83, pp. 3235-3236.
Dombrowskas et al., "Conduction Cooled Chip Module", IBM Technical Disclosure Bulletin, vol. 14, No. 9, 2/72, p. 2689.
J. K. Hassan et al., "Chip Heat Transfer Structure", IBM Technical Disclosure Bulletin, vol. 25, No. 1, 6/82, pp. 315-318.

Affiliated with

Also associated with

Rating

Thermal conduction disc-chip cooling enhancement means does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal conduction disc-chip cooling enhancement means, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal conduction disc-chip cooling enhancement means will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-861868