Thermal conduction device

Heat exchange – With retainer for removable article – Electrical component

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165907, 361385, 357 82, F28F 700

Patent

active

048238635

ABSTRACT:
The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer is provided at the surface part of the contact interface of a heat generating element or a heat sink element, and a liquid such as oil is contained in cavities formed in the porous layer, the heat generating element and the heat sink element being held in close contact by the surface tension of the liquid, whereby heat generated by the heat generating element is transferred to the heat sink element.

REFERENCES:
patent: 3993123 (1976-11-01), Chu et al.
patent: 4209799 (1980-06-01), Schierz et al.
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4266281 (1980-10-01), Chu
patent: 4341432 (1982-07-01), Cutchaw
patent: 4381818 (1983-05-01), Sachar et al.
patent: 4649990 (1987-03-01), Kurihara et al.
Microcapillary Thermal Interface Technology for VLSI Packaging, Tuckerman et al., 9/83, pp. 60-61.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal conduction device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal conduction device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal conduction device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1189146

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.