Thermal conducting medium protector

Details Thermal conducting medium protector Thermal conducting medium protector

2007-03-29

2009-11-24

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S705000, C361S709000, C257S718000, C257S719000, C024S458000, C024S459000, C024S520000, C165S185000, C165S080200, C165S134100

Reexamination Certificate

active

07623350

ABSTRACT:
A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

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patent: 2009/0067133 (2009-03-01), Li et al.

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