Thermal conditioning for integrated circuit testing

Details Thermal conditioning for integrated circuit testing Thermal conditioning for integrated circuit testing

2005-01-18

2005-01-18

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S760020

Reexamination Certificate

active

06844752

ABSTRACT:
Method and apparatus for thermally conditioning a microchip is described. The microchip (104) is thermally conditioned responsive to a temperature target over an interval of time. A diode voltage of a diode (503) of the microchip (104) is measured from which diode temperature is determined. The diode temperature is compared with the temperature target to determine a temperature error. This thermal conditioning may be repeated, where interval times are adjustable responsive to temperature error, until a stabilization band (401) is reached. Because a diode (503) of the microchip (104) is used, junction temperature, as opposed to external surface temperature of the microchip package, is obtained. Accordingly, a thermocouple attached to the external surface of the microchip is not needed.

REFERENCES:
patent: 5498971 (1996-03-01), Turnbull et al.
patent: 6545494 (2003-04-01), Olsen et al.
patent: 6552561 (2003-04-01), Olsen et al.

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