Electricity: power supply or regulation systems – Output level responsive – Using a three or more terminal semiconductive device as the...
Reexamination Certificate
2006-02-24
2008-03-18
Han, Jessica (Department: 2838)
Electricity: power supply or regulation systems
Output level responsive
Using a three or more terminal semiconductive device as the...
C323S907000
Reexamination Certificate
active
07345460
ABSTRACT:
A device and method of providing thermal compensation for integrated circuits, e.g., complementary metal-oxide semiconductor integrated circuits (“IC”) is described. The device is an IC (e.g., digital, analog, and mixed-signal circuits) with a digital voltage control system (“VCS”) having a temperature-adaptive digital DC-to-DC power converter. In one embodiment, the DC-to-DC converter includes a power stage, which converts a voltage of an input power source to a variable supply voltage, a delay-line-based temperature sensing circuit that continuously monitors temperature changes, and adjusts the frequency and process speed of the IC to compensate for any performance degradation caused by thermal effects by adjusting the voltage supplied to the IC to increase or decrease the frequency and process speed of the IC in proportion to any abnormal temperature changes in the IC.
REFERENCES:
patent: 6396250 (2002-05-01), Bridge
patent: 6958592 (2005-10-01), Chapuis
patent: 7098640 (2006-08-01), Brown
patent: 7148667 (2006-12-01), Umemoto et al.
patent: 7249267 (2007-07-01), Chapuis
patent: 2003/0038614 (2003-02-01), Walters et al.
Achenbach, R. et al., “A Digitally Temperature-Compensated Crystal Oscillator,” IEEE Journal of Solid State Circuits, vol. 35, pp. 1502-1507 (2000).
Johns, D.A. et al., Analog Integrated Circuit Design (John Wiley & Sons, Inc., New York, 1997).
Rabaey, J.M. et al., Integrated Circuits—A Design Perspective, 2nd Edition (Prentice Hall, New Jersey, 2003); P. Allen, et al., CMOS Analog Circuit Design (Oxford University Press, New York, 2002).
Zhang , C. et al., “Thermal compensation method for CMOS digital integrated circuits using temperature-adaptive DC/DC converter,” (preprint, submitted to IEEE Trans. on Circuits & Systems II, on Jul. 1, 2005).
Ma Dongsheng
Zhang Chuang
Board of Supervisors of Louisiana State University and Agricultu
Carver James C.
Davis Bonnie J.
Han Jessica
Runnels John H.
LandOfFree
Thermal compensation method for CMOS digital-integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal compensation method for CMOS digital-integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal compensation method for CMOS digital-integrated... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3970139