Thermal compensated circuit board interconnect apparatus and met

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

29840, 29843, 357 68, 357 81, 361386, 361406, 361408, H05K 720

Patent

active

047759178

ABSTRACT:
A circuit board unit includes a substrate with imprinted circuit traces and components. A plurality of traces include connecting areas for connection to another trace area or to an external lead. An interconnect element is soldered to each area. Each element is an integral flat strip-like member bent into a substantial L-shape configuration. The element has a flat, square base plate with a control hole centrally located therein. A terminal leg is interconnected to the base plate by a smoothly curved portion and extends at right angles to the base plate and is aligned with the center of the hole. The outer end is a flat terminal having a pin-like projection. A solder paste on the trace has a configuration conforming to the base plate. The base plate is placed on the solder with a slight pressure. Upon melting of the solder, the hole essentially prevents floating of the element while the conformed plate and paste area align the plate on the solder area as a result of surface tension and wetting effect. The interconnect elements are formed as a series of stamped flat blanks, connected on one edge by a strap having indexing openings for automated movement from a reel supply. The blanks are advanced into a pneumatic forming machine, where it is formed and removed from the strap. A placement head grasps the terminal end of the formed element and places it onto the solder pad. The substrate moves through a reflow soldering unit to solder the interconnect element to the substrate trace. The substrate is placed in a housing with the element abutting an exterior terminal for automated pinch welding.

REFERENCES:
patent: 2752541 (1956-06-01), Losco
patent: 4115838 (1978-09-01), Yagusic et al.
patent: 4278990 (1981-07-01), Fichot

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