Thermal-bonding process and apparatus

Details Thermal-bonding process and apparatus Thermal-bonding process and apparatus

1987-07-01

1990-09-04

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29829, 29846, 29729, 29743, 156285, 156497, 1565833, 219243, H05B 300

Patent

active

049532871

ABSTRACT:
An orifice plate is thermally bonded to a thick film photopolymer spacer fabricated on a print head substrate using heat and compression. The compression is applied by pressurized gas to a pliable sheet covering the orifice plate and substrate assembly. Heat can be supplied through a vacuum chuck on which the assembly is mounted or from a heating element embedded in the pliable sheet. An apparatus comprising an air actuated ram with a flange having an o-ring seated within is used to seal the pliable sheet against the vacuum chuck circumferentially about the assembly. The ram includes a chamber with an open end which is sealed against the pliable sheet when in an engaged position. By filling the chamber with gas under sufficient pressure while heating the spacer forms a bond between the orifice plate and the assembly. After thermal bonding, curing of the photopolymer spacer can be completed in an oven.

REFERENCES:
patent: 2489643 (1949-11-01), Hunter
patent: 2509439 (1950-05-01), Langer
patent: 3533352 (1970-10-01), Miller

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