Thermal bond system

Details Thermal bond system Thermal bond system

1995-10-31

1997-12-02

Jordan, Charles J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

B32B 3100

Patent

active

H00016993

ABSTRACT:
A thermal bond system is provided for bonding a first component that prods heat to a second component that dissipates heat. Carbon or other thermally conductive fiber tows are woven together to define a fabric mesh having first and second opposing woven surfaces. An adhesive bond that is flowable prior to drying is used to wet and cover the first and second opposing surfaces. The adhesive bond extends into interstices formed between adjacent fiber tows.

REFERENCES:
patent: 3694699 (1972-09-01), Snyder et al.
patent: 4842911 (1989-06-01), Fick
patent: 4888247 (1989-12-01), Zweben et al.
patent: 5088007 (1992-02-01), Missele
patent: 5200365 (1993-04-01), Culver
patent: 5224017 (1993-06-01), Martin
patent: 5224030 (1993-06-01), Banks et al.
patent: 5285108 (1994-02-01), Hastings et al.

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