Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-10-20
2002-09-10
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S712000, C361S719000, C257S718000, C257S719000, C257S726000, C257S727000, C174S016300, C165S104330, C165S185000
Reexamination Certificate
active
06449153
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates thermal attachment design. More particularly, the invention relates to an improved apparatus for securing a thermal solution or other cooling device to a mini-cartridge device.
2. Description of the Related Art
A mini-cartridge is a packaging technology designed to protect the electronic components of a printed circuit board (hereinafter “PCB”) and to aid in controlling the thermal interface between the PCB and a thermal attachment (e.g., a heat-sink). As illustrated in
FIG. 1
, one embodiment of a mini-cartridge includes a top cover
110
and a bottom cover
120
which, when attached, surround the PCB substrate
130
and its electronic components (e.g.,
140
,
150
).
The mini-cartridge not only protects the PCB but also provides an interface for connecting the PCB to external electronic components. For example, when a mini-cartridge is provided for a microprocessor and its related circuitry, the cartridge can be secured to a motherboard simply by inserting the cartridge into a motherboard-mounted connector, rather than permanently soldering the mini-cartridge to the motherboard. The mini-cartridge thereby provides protection for the underlying microprocessor and also provides a simplified system for replacing the microprocessor (e.g., in the event that it malfunctions or becomes obsolete).
Electronic components such as microprocessor
210
may dissipate a significant amount of heat. Therefore, when a microprocessor
210
or other high-speed electronic component is secured within a mini-cartridge as described above, a heat dissipation mechanism is required. Otherwise the increased heat trapped within the cartridge could degrade processor performance and/or damage the processor.
SUMMARY OF THE INVENTION
An apparatus is disclosed for attaching a thermal solution to a mini-cartridge. The apparatus comprises: a bracket adapted to be snapped into position around the mini-cartridge; two or more threads formed in the bracket, the threads positioned such that when the bracket is snapped into position around the mini-cartridge the threads are located on the side of the mini-cartridge opposite from the side adjacent to the thermal solution; and screws adapted to run through holes in the mini-cartridge to engage with the threads and to fixedly attach the thermal solution to the mini-cartridge.
REFERENCES:
patent: 5019940 (1991-05-01), Clemens
patent: 5302853 (1994-04-01), Volz et al.
patent: 5473510 (1995-12-01), Dozier, II
patent: 5559675 (1996-09-01), Hsieh et al.
patent: 5703753 (1997-12-01), Mok
patent: 5729433 (1998-03-01), Mok
patent: 5737187 (1998-04-01), Nguyen et al.
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5894408 (1999-04-01), Stark et al.
patent: 5898573 (1999-04-01), Fugaro
patent: 5945736 (1999-08-01), Rife et al.
patent: 5959838 (1999-09-01), Liang
Blakely , Sokoloff, Taylor & Zafman LLP
Chervinsky Boris
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