Thermal assembly for cooling an electronics module

Details Thermal assembly for cooling an electronics module Thermal assembly for cooling an electronics module

2007-07-03

2007-07-03

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S709000, C361S711000, C361S715000, C257S718000, C165S080300, C174S016300

Reexamination Certificate

active

10795496

ABSTRACT:
A thermal assembly for cooling an electronics module is described. The assembly includes a compressible thermal pad, a thermal plate, and a clip. The thermal plate attaches to a heat sink. The clip urges the thermal pad against a surface of the thermal plate. Heat generated by electronics components in the pluggable electronics module is conducted to the heat sink through a thermal path defined by the thermal plate, the compressible thermal pad, and the clip.

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