Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-12-13
2005-12-13
Hu, Shouxiang (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S712000, C257S714000, C257S717000
Reexamination Certificate
active
06975028
ABSTRACT:
An apparatus for controlling the temperature of an electronic device utilizes a thermal head attached to a base structure including an integral isolation arrangement. For example, the isolation arrangement can be formed as a planar spring defined by slots in the base structure. The base structure has a manifold configured to route refrigerant fluid between the thermal head and components of a refrigeration system. The isolation arrangement is normally planar but is movable to facilitate engagement of the thermal head with the electronic device. The isolation arrangement also compensates for variations in the planar orientation of the electronic device.
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International Search Report dated Nov. 24, 2004 for corrresponding PCT Application No. PCT/US2004/07890, international filing date Mar. 16, 2004.
Barnes Cynthia M.
Gage Derek E.
Mahaffey Charles M.
Sharpley Todd C.
Spearing Ian G.
Delta Design, Inc.
Foley & Lardner LLP
Hu Shouxiang
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