Thermal analysis in a data processing system

Details Thermal analysis in a data processing system Thermal analysis in a data processing system

2005-05-10

2005-05-10

Norman, Marc (Department: 3744)

Automatic temperature and humidity regulation

Ventilator type

Electrically actuated

C062S178000, C062S259200, C361S696000

Reexamination Certificate

active

06889908

ABSTRACT:
Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.

REFERENCES:
patent: 4527231 (1985-07-01), Aucel et al.
patent: 4817865 (1989-04-01), Wray
patent: 5197666 (1993-03-01), Wedekind
patent: 5410448 (1995-04-01), Barker, III et al.
patent: 5471099 (1995-11-01), Larabell et al.
patent: 5491610 (1996-02-01), Mok et al.
patent: 5623834 (1997-04-01), Bahel et al.
patent: 5904478 (1999-05-01), Weaver et al.
patent: 6082623 (2000-07-01), Chang
patent: 6188189 (2001-02-01), Blake
patent: 6198245 (2001-03-01), Du et al.
patent: 6280317 (2001-08-01), Przilas et al.
patent: 6356444 (2002-03-01), Pedoeem
patent: 6535382 (2003-03-01), Bishop et al.
patent: 6628520 (2003-09-01), Patel et al.
patent: 6639794 (2003-10-01), Olarig et al.
patent: 6707669 (2004-03-01), Lee

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