Thermal measuring and testing – Thermal gravimetric analysis
Reexamination Certificate
2011-04-12
2011-04-12
Verbitsky, Gail (Department: 2855)
Thermal measuring and testing
Thermal gravimetric analysis
C374S012000, C374S031000, C374S208000
Reexamination Certificate
active
07922386
ABSTRACT:
A thermal analysis apparatus includes: a sample temperature control device for surrounding a sample placed on a measurement position and controlling the temperature of the sample; a balance beam for supporting the sample and capable of tilting about a pivot point; and a sample moving device that allows the balance beam to slide between a first position at which the sample is situated at the measurement position and a second position at which the sample is situated at a distant position which is a position outside the sample temperature control unit. The distant position is a position which is deviated laterally from a line trajectory extending from the measurement position to the outside of the sample temperature control device. When the sample is at the measurement position, the balance beam is allowed to linearly slide and subsequently to rotationally slide about an axial line, to thereby transport the sample from the measurement position to the distant position.
REFERENCES:
patent: 3074270 (1963-01-01), Rabb
patent: 3271996 (1966-09-01), Ferenc et al.
patent: 3373598 (1968-03-01), Johnson et al.
patent: 4596470 (1986-06-01), Park
patent: 5293404 (1994-03-01), Takeda
patent: 6057516 (2000-05-01), Nakamura et al.
patent: 6257757 (2001-07-01), Nakamura
patent: 6860136 (2005-03-01), Hay et al.
patent: 7444880 (2008-11-01), Zhang et al.
patent: 2003/0007542 (2003-01-01), Peterman et al.
patent: 2007/0009009 (2007-01-01), Dziki
patent: 2008/0144694 (2008-06-01), Danley et al.
patent: 2 360 064 (1978-02-01), None
patent: 2 543 683 (1984-10-01), None
patent: 4-361145 (A) (1992-12-01), None
patent: 2005-331432 (A) (2005-12-01), None
patent: WO 2006/090247 (2006-08-01), None
European Search Report in Application No. 07253757.4-2204 dated Dec. 27, 2007.
Buchanan & Ingersoll & Rooney PC
Rigaku Corporation
Verbitsky Gail
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