Thermal analysis and characterization of layers and multiple...

Details Thermal analysis and characterization of layers and multiple... Thermal analysis and characterization of layers and multiple...

2006-05-23

2006-05-23

Stein, Stephen (Department: 1775)

Thermal measuring and testing

Differential thermal analysis

C374S031000, C374S036000, C374S043000, C374S045000

Reexamination Certificate

active

07048434

ABSTRACT:
Thermally analysis of layers and multiple layer structures used in the semiconductor processing arts is disclosed. A modulated calorimetric analysis may be used to determine a thermal signature that characterizes the chemical properties of a sample of material. The signature may include one or more thermal properties such as heat capacities. The signature may be used to compare and infer the suitability of a material for use in an integrated circuit manufacturing process. A thermal signature for a material that is not known to be suitable for manufacturing integrated circuits may be compared with a thermal signature for a standard material that is known to be suitable in order to determine whether the aforementioned material is suitable. Multiple layer structures may also be analyzed, compared, and inferred, and approaches for determining thermal signatures for any individual layer of the multiple layer structure are disclosed.

REFERENCES:
patent: 5217305 (1993-06-01), Yamakawa et al.
patent: 5342892 (1994-08-01), Vanderbilt et al.
patent: 5869647 (1999-02-01), Narayan et al.
patent: 6054868 (2000-04-01), Borden et al.
patent: 08284646 (1996-10-01), None

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