Thermal activation device for heat-sensitive self-adhesive...

Incremental printing of symbolic information – Thermal marking apparatus or processes

Reexamination Certificate

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Details

C156S320000, C156S322000, C156S384000, C156S387000

Reexamination Certificate

active

06850262

ABSTRACT:
A thermal activation device (thermal activation unit A1) for heat-sensitive self-adhesive sheet at least includes: a thermally-activating thermal head for thermally activating a heat-sensitive adhesive layer of a heat-sensitive self-adhesive sheet including a sheet-like substrate formed with a printable surface on one side thereof and with the heat-sensitive adhesive layer on the other side thereof; and a platen roller (41) for conveying the heat-sensitive self-adhesive sheet in a predetermined direction, the device wherein the platen roller includes adhesive-mass removing means for removing an adhesive mass (G2) of the heat-sensitive adhesive adhered to a periphery of the platen roller, and wherein the adhesive-mass removing means includes: a transfer roller (42) slidably contacting the periphery of the platen roller as located near an exit of the heat-sensitive self-adhesive sheet, thereby allowing the adhesive mass adhered to the periphery of the platen roller to be transferred thereto; and a cleaning sheet (heat-sensitive self-adhesive sheet R) inserted through space between the transfer roller and the platen roller thereby removing the adhesive mass adhered to a periphery of the transfer roller by allowing the adhesive mass to be transferred thereto.

REFERENCES:
patent: 4397709 (1983-08-01), Schwenzer
patent: 4468274 (1984-08-01), Adachi
patent: 4707211 (1987-11-01), Shibata
patent: 4784714 (1988-11-01), Shibata
patent: 5846358 (1998-12-01), Nagamoto et al.
patent: 6031553 (2000-02-01), Nagamoto et al.
patent: 6172698 (2001-01-01), Iwata et al.
patent: 6501495 (2002-12-01), Ichikawa et al.
patent: 20040066448 (2004-04-01), Hoshino et al.
patent: 0788972 (1997-08-01), None
patent: 02-117846 (1990-05-01), None
patent: 03-010875 (1991-01-01), None
Patent Abstracts of Japan vol. 2000, no. 02, (Feb. 29, 2000) JP 11 327447 A (Ricoh Co. Ltd), (Nov. 26, 1999).

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