TFI probe I/O wrap test method

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S407010, C029S825000, C029S846000

Reexamination Certificate

active

07007380

ABSTRACT:
A method for testing external connections to semiconductor devices. The method includes providing an external electrical path between selected external connections on the semiconductor devices.

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W.H. McAnney, “Improving the Fault Coverage of Boundary Scan,” Research Disclosure, Mar. 1991, No. 323, England.
“Contactless On-Chip AC I/O Wrap Test,” Research Disclosure 41, Sep. 1998, Kenneth Mason Publications Ltd., England.

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