Textured thin-film substrate and method

Details Textured thin-film substrate and method Textured thin-film substrate and method

1991-06-03

1992-11-24

Powell, William A.

Stock material or miscellaneous articles

All metal or with adjacent metals

Microscopic interfacial wave or roughness

29603, 156651, 156656, 1566591, 156664, 252 792, 360135, 369276, 427130, 428687, 428900, B44C 122, C23F 100, G11B 574, G11B 370

Patent

active

051660067

ABSTRACT:
A method of forming an isotropic texture having a selected summit density and surface roughness in a selected inner-diameter annular zone of a thin-film medium substrate having a polished metal coating on the substrate. The zone is selectively exposed to a chemical etchant, under etchant strength, temperature, and exposure time, until the selected summit density and roughness are achieved. In a preferred embodiment, the etching conditions are selected to produce a summit density between about 500-20,000/mm.sup.2, and an arithmetic mean roughness value between about 20-70 .ANG. in the inner zone, and a substantially reduced roughness value in an annular, isotropically textured outer-diameter zone of the coating. A thin-film medium formed on the substrate is suitable for near-contact recording.

REFERENCES:
patent: 4726006 (1988-02-01), Benne et al.

Affiliated with

Also associated with

Rating

Textured thin-film substrate and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Textured thin-film substrate and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Textured thin-film substrate and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-920795