Tetra aza ligand systems as complexing agents for electroless de

Details Tetra aza ligand systems as complexing agents for electroless de Tetra aza ligand systems as complexing agents for electroless de

1989-04-28

1991-10-22

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 123, 427 98, 427304, 427437, C23C 2200, C23C 1800

Patent

active

050592432

ABSTRACT:
An electroless copper plating bath uses a series of tetradentate nitrogen ligands. The components of the bath may be substituted without extensive re-optimization of the bath. The Cu-tetra-aza ligand baths operates over a pH range between 7 and 12. Stable bath formulations employing various buffers, reducing agents and ligands have been developed. The process can be used for metal deposition at lower pH and provides the capability to use additive processing for metallization in the presence of polyimide, positive photoresist and other alkali sensitive substrates.

REFERENCES:
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patent: 3870526 (1975-03-01), Pearlstein et al.
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patent: 4643793 (1987-02-01), Nakaso et al.
patent: 4818286 (1989-04-01), Jagannathan et al.
Pearlstein et al., "Electroless Copper Plating Using Dimethylamine Borane", Plating, vol. 60, No. 5, 1973, pp. 474-476.
"Electroless Copper Plating" in Modern Electroplating (book), Ed. F. A. Lowenheim, John Wiley, 1974, pp. 734-739.

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