Testing method of wafer with thin-film magnetic heads and...

Details Testing method of wafer with thin-film magnetic heads and... Testing method of wafer with thin-film magnetic heads and...

2009-05-28

2011-12-06

Nguyen, Vinh (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S210000, C360S110000

Reexamination Certificate

active

08072231

ABSTRACT:
A testing method of a wafer provided with a plurality of thin-film magnetic heads is provided. Each of the plurality of thin-film magnetic heads includes a main pole layer, a first test pad formed on the wafer and electrically connected with an extended top end section of the main pole layer and a second test pad formed on the wafer and electrically connected with a back end section of the main pole layer. The testing method includes a step of measuring an electrical resistance between the first test pad and the second test pad, a step of judging whether the measured electrical resistance is within a set range, and a step of discriminating that the thin-film magnetic head is a non-defective product when the measured electrical resistance is within the set range.

REFERENCES:
patent: 6623330 (2003-09-01), Fukuroi
patent: 7359152 (2008-04-01), Matono et al.
patent: 7821744 (2010-10-01), Takahashi et al.
patent: 2007/0105248 (2007-05-01), Katoh
patent: 2008/0100960 (2008-05-01), Kakehi et al.
patent: 2008/0291579 (2008-11-01), Uesugi et al.
patent: A-06-333213 (1994-12-01), None

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