Testing integrated circuit chips

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324765, G01R 3102

Patent

active

060377860

ABSTRACT:
An interposer for making a penetrating temporary contact between the contact pads of a chip having bumped or unbumped I/O pads and a test board for the purpose of testing the chip is disclosed. The interposer comprises a silicon substrate having sharp penetrating structures integrally formed at a predetermined depth in the silicon substrate along crystallographic planes. The resultant apparatus has a matching lateral thermal expansion to the chip being tested and provides uniform contact to all chip I/O pads.

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