Testing BGA solder joints by localized pulsed-heat thermography

Details Testing BGA solder joints by localized pulsed-heat thermography Testing BGA solder joints by localized pulsed-heat thermography

2008-04-15

2010-12-07

Caputo, Lisa M (Department: 2855)

Thermal measuring and testing

Temperature measurement

In spaced noncontact relationship to specimen

C374S005000, C374S057000, C374S141000

Reexamination Certificate

active

07845849

ABSTRACT:
A pulse of heat or cold is applied and conducted transversely through a ball grid array device and a printed circuit board via a selected one of the solder joints between them. Heat diffused through the other solder joints is neutralized by a thermal bias shield. The shield is then removed and a thermographic image of the printed circuit board is taken. The process is repeated for each solder joint, and the images are compared to identify defective solder joints.

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patent: 2004/0028113 (2004-02-01), Schlagheck et al.
Avdelidis, N.P. and Wallace, P., “Pulsed thermography in the investigation of PCBs for defect detection & analysis”, 9 pp., NDT Group, TWI Technology Centre, South Wales, UK.

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