Testing assembly having a pressed joint with a single layer of t

Details Testing assembly having a pressed joint with a single layer of t Testing assembly having a pressed joint with a single layer of t

1997-12-08

2000-08-22

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361690, 361704, 361707, 257714, 174 163, 165121, 165185, 428614, H05K 720

Patent

active

061082082

ABSTRACT:
An electromechanical assembly, having a pressed joint with a low thermal resistance which is residue free when disassembled, includes: 1) an integrated circuit module having a contact surface of a first material; 2) a temperature regulating unit having a contact surface of a second material which faces the contact surface of the first material and which is separated therefrom by a gap; and, 3) a film of a metal alloy, which substantially fills the gap, and which is limited to an alloy that adheres in a solid state to the second material but not the first material. Preferred alloys for filling the gap include combinations of two or more metals which are selected from the group of lead, tin, bismuth, cadmium, indium, and antimony. Preferred first materials for the contact surface on the integrated circuit module to which the alloy does not adhere include silicon dioxide, aluminum nitrite, silicon and ceramic. Preferred second materials for the contact surface on the temperature regulating unit to which the alloy does adhere include copper, nickel, zinc, and aluminum which is plated with copper, nickel or zinc.

REFERENCES:
patent: 4034468 (1977-07-01), Koopman
patent: 4069498 (1978-01-01), Joshi
patent: 4092697 (1978-05-01), Spaight
patent: 4254431 (1981-03-01), Babuka et al
patent: 4558395 (1985-12-01), Yamada et al.
patent: 4581011 (1986-04-01), Kohara et al.
patent: 4607277 (1986-08-01), Hassan et al.
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4879632 (1989-11-01), Yamamoto et al.
patent: 5024264 (1991-06-01), Natori et al.
patent: 5144531 (1992-09-01), Go et al.
patent: 5234149 (1993-08-01), Katz et al.

Affiliated with

Also associated with

Rating

Testing assembly having a pressed joint with a single layer of t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Testing assembly having a pressed joint with a single layer of t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Testing assembly having a pressed joint with a single layer of t will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-588312