Testing apparatus for leadless package containing a high-frequen

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324 725, 324158P, G01R 3102, G01R 106

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active

047695919

ABSTRACT:
A testing apparatus for a high-frequency integrated-circuit chip contained in a leadless package, which enables the transmission of signals from n input/output contacts of the chip to measuring apparatus by means of high-frequency lines having a given characteristic impedance. The apparatus comprises a rigid dielectric plate having on a front surface a printed circuit forming a network of n high-frequency coplanar transmission lines having the given characteristic impedance. The apparatus includes first means for connecting n contacts of the package to n inputs of the coplanar transmission lines and second means for connecting n outputs of the transmission lines to coaxial high-frequency lines having the same given impedance, which supply the measuring apparatus.

REFERENCES:
patent: 4574235 (1986-03-01), Kelly et al.
patent: 4593243 (1986-06-01), Lao et al.
patent: 4686463 (1987-08-01), Logan

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