Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2005-10-04
2005-10-04
Tang, Minh N. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S754090
Reexamination Certificate
active
06952110
ABSTRACT:
A method of manufacturing a semiconductor device has forming process for forming a semiconductor device on a major surface of a wafer, and testing process for testing defect of the semiconductor device. The testing process includes bringing a testing apparatus into contact with test electrodes of the semiconductor device. The testing apparatus has a contactor including probes that come into contact with the test electrodes of the semiconductor device, and secondary electrodes electrically connected to the probes and disposed on a surface opposite to the probes; and a substrate on which electrodes electrically communicated to the contactor by a conducting device. The conducting device is so formed that stress applied to the conducting device in the state where the probes are in contact with the test electrodes is larger than stress applied to the conducting device in the state where the probes are not in contact with the test electrodes.
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Aoki Hideyuki
Kanamaru Masatoshi
Kohno Ryuji
Miura Hideo
Shimizu Hiroya
Renesas Technology Corporation
Townsend and Townsend / and Crew LLP
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