Testing and finishing apparatus for integrated circuit package u

Details Testing and finishing apparatus for integrated circuit package u Testing and finishing apparatus for integrated circuit package u

1993-11-12

2000-12-05

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

H01L 2100, H01L 2164

Patent

active

061560782

ABSTRACT:
A testing and finishing system for a discrete or combinational use of apparatus in an automated method of testing, marking, sorting and packing integrated circuit package units is disclosed.
The assembly facility comprises:

REFERENCES:
patent: 4997364 (1991-03-01), McGrath et al.
Webster's Ninth New Collegiate Dictionary, p. 715, Marriam-Webster Inc., 1985 ISBN 0-87779-508-8.

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