Testing and exercising individual, unsingulated dies on a wafer

Details Testing and exercising individual, unsingulated dies on a wafer Testing and exercising individual, unsingulated dies on a wafer

1995-12-26

1998-11-17

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, 324 731, 3241581, G01R 3128

Patent

active

058381635

ABSTRACT:
Signals (including probes) from an external system are selectively connected to a plurality of unsingulated dies on a semiconductor wafer with a minimum number of connections and an electronic selection mechanism resident on the wafer. The electronic selection mechanism is connected to the individual dies by conductive lines on the wafer. The electronic selection mechanism is capable of providing the external signals (or connecting the external probe) to a single die or groups of the dies, and electronically "walking through" the entire plurality of unsingulated dies. Redundant conductive lines may be provided. Diodes and/or fuses may be provided in conjunction with the conductive lines, to protect against various faults which may occur in the conductive lines. Redundant electronic selection mechanisms may also be provided to ensure the ability to selectively provide signals to the unsingulated dies.

REFERENCES:
patent: 4486705 (1984-12-01), Stopper
patent: 4956602 (1990-09-01), Parrish
patent: 4961053 (1990-10-01), Krug
patent: 5053700 (1991-10-01), Parrish
patent: 5059899 (1991-10-01), Farnworth et al.
patent: 5266890 (1993-11-01), Kumbasar et al.

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