Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-03-07
1998-05-12
Ledynh, Bot L.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361709, 361772, 361774, 361777, 174260, H05K 702, H01R 900
Patent
active
057515549
ABSTRACT:
An integrated circuit handling, packaging and testing apparatus in the form of a testable chip carrier comprising a rigid substrate onto which a chip may be bonded, and which provides a high density interconnect pattern orthogonally aligned to the chip bond pads for wire bonding thereto. The interconnect also provides external bonding points patterned for similar orthogonal alignment to the external device to which the chip is to be connected, and the dimensions of the carrier are substantially smaller than an equivalent standard or custom package type. A hermetic or non-hermetic seal lidding operation may be carried out on the chip and carrier. The carrier also provides a detachable test perimeter allowing full-functional testing and burn-in of the attached wire-bonded chip prior to placement on a printed circuit board or multi-chip module. Signal integrity is improved by the exact alignment of the carrier-to-chip and carrier-to-external device connections, and manufacturing techniques allow for the use of optimum interconnect materials, multi-layer structures and the addition of passive components external to the chip. The carriers may be integrated with heatsinks.
REFERENCES:
patent: 4598337 (1986-07-01), Wuthrich et al.
patent: 4922324 (1990-05-01), Sudo
patent: 5034568 (1991-07-01), Mather
patent: 5235496 (1993-08-01), Chomette et al.
McGeary Michael Lawrence
Williams Simon Mark
Digital Equipment Corporation
Fisher Arthur W.
Ledynh Bot L.
Maloney Denis G.
McGuinness Lindsay G.
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